? semiconductor components industries, llc, 2014 august, 2014 ? rev. 12 1 publication order number: mc74hc32a/d mc74hc32a quad 2-input or gate high?performance silicon?gate cmos the mc74hc32a is identical in pinout to the ls32. the device inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. features ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos and ttl ? operating voltage range: 2.0 to 6.0 v ? low input current: 1 a ? high noise immunity characteristic of cmos devices ? in compliance with the jedec standard no. 7 a requirements ? chip complexity: 48 fets or 12 equivalent gates ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant 3 y1 1 a1 pin 14 = v cc pin 7 = gnd logic diagram 2 b1 6 y2 4 a2 5 b2 8 y3 9 a3 10 b3 11 y4 12 a4 13 b4 y = a+b http://onsemi.com marking diagrams a = assembly location l, wl = wafer lot y, yy = year w, ww = work week g or = pb?free package tssop?14 dt suffix case 948g soic?14 nb d suffix case 751a hc32ag awlyww 1 14 hc 32a alyw 1 14 see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information (note: microdot may be in either location) tssop?14 soic?14 nb pin assignment 13 14 12 11 10 9 8 2 1 34567 v cc b4 a4 y4 b3 a3 y3 a1 b1 y1 a2 b2 y2 gnd 14?lead (top view) l l h h l h l h function table inputs output ab l h h h y
mc74hc32a http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage (referenced to gnd) ?0.5 to +7.0 v v in dc input voltage (referenced to gnd) ?0.5 to v cc + 0.5 v v out dc output voltage (referenced to gnd) ?0.5 to v cc + 0.5 v i in dc input current, per pin 20 ma i out dc output current, per pin 25 ma i cc dc supply current, v cc and gnd pins 50 ma p d power dissipation in still air, soic package? tssop package? 500 450 mw t stg storage temperature ?65 to +150 c t l lead temperature, 1 mm from case for 10 seconds plastic dip, soic or tssop package 260 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ?derating: soic package: ?7 mw/ c from 65 to 125 c tssop package: ?6.1 mw/ c from 65 to 125 c recommended operating conditions symbol parameter min max unit v cc dc supply voltage (referenced to gnd) 2.0 6.0 v v in , v out dc input voltage, output voltage (referenced to gnd) 0 v cc v t a operating temperature, all package types ?55 +125 c t r , t f input rise and fall time v cc = 2.0 v (figure 1) v cc = 4.5 v v cc = 6.0 v 0 0 0 1000 500 400 ns functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high?impedance cir- cuit. for proper operation, v in and v out should be constrained to the range gnd (v in or v out ) v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc74hc32a http://onsemi.com 3 dc characteristics (voltages referenced to gnd) v cc v guaranteed limit symbol parameter condition ?55 to 25 c 85 c 125 c unit v ih minimum high?level input voltage v out = 0.1v or v cc ?0.1v |i out | 20 a 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 v v il maximum low?level input voltage v out = 0.1v or v cc ? 0.1v |i out | 20 a 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 v v oh minimum high?level output voltage v in = v ih or v il |i out | 20 a 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 v v in =v ih or v il |i out | 2.4ma |i out | 4.0ma |i out | 5.2ma 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 v ol maximum low?level output voltage v in = v ih or v il |i out | 20 a 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il |i out | 2.4ma |i out | 4.0ma |i out | 5.2ma 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 i in maximum input leakage current v in = v cc or gnd 6.0 0.1 1.0 1.0 a i cc maximum quiescent supply current (per package) v in = v cc or gnd i out = 0 a 6.0 1.0 10 40 a ac characteristics (c l = 50pf, input t r = t f = 6ns) v cc v guaranteed limit symbol parameter ?55 to 25 c 85 c 125 c unit t plh , t phl maximum propagation delay, input a or b to output y (figures 1 and 2) 2.0 3.0 4.5 6.0 75 30 15 13 95 40 19 16 110 55 22 19 ns t tlh , t thl maximum output transition time, any output (figures 1 and 2) 2.0 3.0 4.5 6.0 75 27 15 13 95 32 19 16 110 36 22 19 ns c in maximum input capacitance 10 10 10 pf c pd power dissipation capacitance (per buffer)* typical @ 25 c, v cc = 5.0 v, v ee = 0 v pf 20 * used to determine the no?load dynamic power consumption: p d = c pd v cc 2 f + i cc v cc .
mc74hc32a http://onsemi.com 4 figure 1. switching waveforms output y input a or b c l * *includes all probe and jig capacitance test point 90% 50% 10% t tlh device under test output figure 2. test circuit y a b figure 3. expanded logic diagram (1/4 of the device) t thl t plh t phl t r t f gnd v cc 90% 50% 10%
mc74hc32a http://onsemi.com 5 ordering information device package shipping ? MC74HC32ADG soic?14 nb (pb?free) 55 units / rail mc74hc32adr2g soic?14 nb (pb?free) 2500 / tape & reel mc74hc32adtr2g tssop?14 (pb?free) 2500 / tape & reel nlv74hc32adg* soic?14 nb (pb?free) 55 units / rail nlv74hc32adr2g* soic?14 nb (pb?free) 2500 / tape & reel nlv74hc32adtr2g* tssop?14 (pb?free) 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable
mc74hc32a http://onsemi.com 6 package dimensions tssop?14 case 948g issue b dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ?w?. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ?u? seating plane 0.10 (0.004) ?t? ??? ??? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ?v? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc32a http://onsemi.com 7 package dimensions soic?14 nb case 751a?03 issue k notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b does not include dambar protrusion. allowable protrusion shall be 0.13 total in excess of at maximum material condition. 4. dimensions d and e do not include mold protrusions. 5. maximum mold protrusion 0.15 per side. h 14 8 7 1 m 0.25 b m c h x 45 seating plane a1 a m s a m 0.25 b s c b 13x b a e d e detail a l a3 detail a dim min max min max inches millimeters d 8.55 8.75 0.337 0.344 e 3.80 4.00 0.150 0.157 a 1.35 1.75 0.054 0.068 b 0.35 0.49 0.014 0.019 l 0.40 1.25 0.016 0.049 e 1.27 bsc 0.050 bsc a3 0.19 0.25 0.008 0.010 a1 0.10 0.25 0.004 0.010 m 0 7 0 7 h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 6.50 14x 0.58 14x 1.18 1.27 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mc74hc32a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemni fy and hold scillc and its officers, em ployees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
|
